Edward I. Cole Jr. received the B.S. (1981), M.S. (1985), and Ph.D. (1987) in physics from the University of North Carolina. He joined the Failure Analysis Department of Sandia National Laboratories in 1987. His research interests are in the development and improvement of non-destructive IC failure analysis tools, with emphasis on electron and optical beam techniques and he has published frequently in the field of failure analysis. Two failure analysis techniques developed by teams Dr. Cole led won R&D 100 awards in 1995 (CIVA) and 1998 (LIVA). In 1995 Dr. Cole was named a Distinguished Member of the Technical Staff at Sandia National Laboratories and in 2005 a Sandia Senior Scientist. He has served on the executive and management committees of the ISTFA and IRPS conferences, chairing the ISTFA'96 event and the IRPS'07 symposium. He is a past president of the Electronic Device Failure Analysis Society (EDFAS) and former EDFA magazine editor.
Cheryl Hartfield is an applications specialist at Omniprobe, Inc. in Dallas, Texas. She previously was a Senior Member of the Technical Staff at Texas Instruments, where she worked for 12 years applying characterization tools and techniques to understand silicon/packaging interactions for a packaging development group. While at TI, Cheryl also pioneered applications of Scanning Acoustic Microscopy for the inspection of damage in packaged ICs and developed methods for TEM sample preparation in TI’s first dual-beam FIB at TI’s Central Research Labs. Cheryl has authored over 20 papers and 2 book chapters, has won 3 Best Presentation awards, and served as General Chair for the 2006 International Symposium on Test and Failure Analysis (ISTFA). She received B.S. and M.S. degrees in microbiology from Texas A&M (1986) and UT Southwestern Medical Center at Dallas (1989).
Christopher Henderson received his B.S. in Physics from the New Mexico Institute of Mining and Technology and his M.S.E.E. from the University of New Mexico. Chris is the President of Semitracks Inc., a United States based company that provides education and training to the semiconductor industry. Chris also teaches courses in failure analysis, reliability and semiconductor technology for the semiconductor industry. From 1988 to 2004 he worked at Sandia National Laboratories, where he was a Principal Member of Technical Staff in the Failure Analysis Department and Microsystems Partnerships Department. His job responsibilities have included failure and yield analysis of components fabricated at Sandia’s Microelectronics Development Laboratory, research into the electrical behavior of defects, and consulting on microelectronics issues for the DoD. He has published over 20 papers at various conferences in semiconductor processing, reliability, failure analysis, and test. He has received two R&D 100 awards and two best paper awards. Prior to working at Sandia, Chris worked for Honeywell, BF Goodrich Aerospace, and Intel. Chris is a member of IEEE and EDFAS (the Electron Device Failure Analysis Society).
Dr. Thomas Moore received the Bachelors in physics (1976), Masters (1978), and Ph.D. (1980) in materials science engineering from the University of Virginia. He began work in the Central Research Labs, Texas Instruments, Dallas in 1980 as a Member of the Materials Science Labs doing semiconductor materials and device analysis. He rose to the level of Distinguished Member of the Technical Staff at TI, managing the Silicon Technology Ramp and Advanced Characterization Department at TI. He is currently the President of Omniprobe Inc. Dr. Moore is a member of the IEEE, the APS and the EMSA.
Gay Samuelson accepted a position as a Research Technologist at Barrow Neurological Institute after retiring from Intel. She has 29 years experience in materials characterization, microelectronic device failure analysis and yield analysis, reliability engineering, and test. Gay continues to have editorial responsibility in IEEE Transactions on Device and Materials Reliability (TDMR), teach the Semitracks Package Technology course, and chaired the 2007 Advanced Materials Failure Analysis workshop. She obtained a BS in biochemistry from University of Alberta in 1964, and MS and PhD degrees in biochemistry from the University of Wisconsin in 1966 and 1969 respectively.
Jerry Walraven currently works as a failure analyst at Sandia National Laboratories focusing on micro-electromechanical systems or MEMS technology. Jeremy has worked in the field of MEMS failure analysis over the past 10 years and has publications in the Electronic Device Failure Analysis desk reference, ISTFA, IRPS, ESREF and SPIE conferences as well as teaching short courses on MEMS technology. He is currently serving on the ISTFA 2008 organizing committee as the tutorial chair and is on the EDFAS board of directors. His research interests include development of MEMS failure analysis techniques, electrostatic discharge effects on MEMS and general FA technique training and development.
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