08:00 AM - Opening

08:15 AM - Javier Santillan, General Electric

High Resolution Computed Tomography for 3D Structure and Failure Analysis

09:15 PM - Jack Coats in lieu of Wenbing Yun, Xradia

Multilength Scale 3D Imaging of Biological Specimens with Resolution from Micrometer to Nanometer

10:15 AM - Break

10:30 AM - William Vanderlinde, IARPA

Government Funding for Circuit Analysis Tools

11:30 AM - Jeff Yarger, Arizona State University

Characterizing the Physical and Mechanical Properties of Amorphous Materials

12:30 PM - Lunch

02:00 PM - Sriram Subramaniam, NIH

Visualizing Cells and Viruses at Molecular Resolution using 3D Electron Microscopy: From Structure to Mechanism

03:00 PM - Gary Shade, Insight Analytical Labs

Counterfeit Risk Management and Mitigation

04:00 PM - Break

04:15 PM - Diganta Das, CALCE, University of Maryland

Counterfeit Electronics – The Problem Goes Beyond Parts

05:15 PM - Wrap-up