High Resolution Computed Tomography for 3D Structure and Failure
Javier D. Santillan, Ph.D.
General Electric
Abstract:
X-ray computed tomography is the only technique for non-destructive examination of the internal structure of complex samples. Any internal difference that corresponds to a contrast in material, density or porosity can be visualized and measured. NDT and metrology on the micro- and nano-scale will be discussed.
Multilength Scale 3D Imaging of Biological Specimens with Resolution from Micrometer to Nanometer
Dr. Jack Coats in lieu of Dr. Wenbing Yun
President, CTO, Founder
Xradia, Inc.
Abstract:
X-ray computed tomography (XCT) offers powerful non-destructive three dimensional imaging capabilities with micrometer to nanometer scale resolution that enable researchers to image complex biological specimens in fine details to get insight. The state-of-the-art capabilities of Xradia’s multi-length scale x-ray imaging solution will be presented through application examples. For example, imaging of bones with unprecedented resolution and contrast will be presented and discussed. Applications including tissue engineering, lung and heart disease study, toxicology will be also discussed.
IARPA Circuit Analysis Tools Program Update
Dr. William E. Vanderlinde
Program Manager
IARPA
Abstract:
The Intelligence Advanced Research Projects Activity (IARPA) continues to move forward with the new Circuit Analysis Tools (CAT) program. The CAT program will be developing new fault isolation, circuit edit, and debug tools to meet the needs of the 22 nm technology node and beyond, and complex packages like stacked chips. The CAT technical requirements are closely aligned to the “Gap Analysis” report produced by the IC Failure Analysis Council (ICFAC) and the Package and Interconnect Failure Analysis Council (PIFAC). IARPA held an “Industry Day Workshop” on April 2nd, a “Proposers’ Day Workshop” on July 24th, and released a Broad Agency Announcement (BAA) on September 3rd. The BAA solicited proposals in four technical thrust areas: Circuit Edit, Fault Isolation, Logic Analysis, and Fast Imaging. IARPA is looking for significant improvements in tool technology, including revolutionary tools and techniques that will enable electrical and physical measurements on future generations of integrated circuits. The program may fund up to four years of research and development culminating in a set of prototype tools for advanced technology nodes down to and including 11nm. White papers were due on October 16th and full proposals were due on December 11th. It is expect that awards will be announced by April 2010. Further information on the program can be found at www.iarpa.gov.
Characterizing the Physical and Mechanical Properties of Amorphous Materials
Jeffery L. Yarger,
Arizona State University,
Tempe, AZ 85287-1604 USA.
Abstract:
Many of the advanced materials used today have some degree of disorder or amorphous character. These disordered regions and materials often get overlooked in standard characterization techniques, which typically rely on crystalline or ordered lattices. Our group at ASU has focused on developing techniques to better elucidate the molecular level physical and mechanical characteristics of amorphous materials and the interface between amorphous and crystalline regions of materials. Specially, this talk will focus on introducing the technique of Solid-State Nuclear Magnetic Resonance (SS-NMR) and providing examples of its use in elucidation of molecular structure and dynamics in advanced materials. However, I will also introduce a new technique our group has developed for characterizing the mechanical properties of materials, Angle Dispersive Brillouin (ADB) Scattering and Imaging. The combination of SS-NMR and ADB allows us to look at both physical and mechanical properties of amorphous materials.
Visualizing Cells and Viruses at Molecular Resolution with 3D Electron Microscopy
Sriram Subramaniam
Senior Investigator
National Cancer Institute
NIH, Bethesda, MD 20892
Abstract:
Emerging methods in 3D biological electron microscopy provide powerful tools and great promise to bridge a critical gap in imaging in the biomedical size spectrum. This comprises a size range of considerable interest that includes cellular protein machines, giant protein and nucleic acid assemblies, small subcellular organelles and bacteria. These objects are generally too large and/or too heterogeneous to be investigated by high resolution X-ray and NMR methods; yet the level of detail afforded by conventional light and electron microscopy is often not adequate to describe their structures at resolutions high enough to be useful in understanding the chemical basis of biological function. The long-term mission of our research program is to obtain an integrated molecular understanding of cellular architecture by combining novel technologies for 3D biological imaging with advanced methods for image segmentation and computational analysis. I will review our recent progress in imaging and modeling dynamic biological systems, with particular emphasis on applications to signal transduction, HIV/AIDS and cancer.
Counterfeit Risk and Mitigation
Gary F. Shade
Abstract:
The perspective of this presentation is on the proactive methods available for mitigation of counterfeit risk. Specific focus will be on methods for integrated circuits, discretes and passives. Resources for risk mitigation are growing and it is important to consider the options and the perspectives of the multitude of providers. Case studies will be provided along with discussion of available resources.
Counterfeit Electronics - The Problem Goes Beyond Parts
Dr. Diganta Das
CALCE, University of Maryland
Abstract:
Examples of Counterfeit Electronic Parts are reported in industry literature in detail in the last several years. By now, most responsible organizations have some level of awareness on the risk of counterfeit electronic parts. However, the risk of counterfeit in electronic systems is not limited to electronic parts. Counterfeiting in ancillary items such as connectors, batteries, wiring can result in same level of system problems as counterfeit parts but the methods of identifying and avoiding them are less developed. On the other end of the chain, materials that go into making electronic parts and circuit can be targets of counterfeiting. This presentation will provide discussions on such new areas of possible counterfeiting and their consequences with examples.
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