Eric Vogel, University of Texas, Dallas
Metrology for Emerging Device and Materials
Bruce Gnade, University of Texas, Dallas
Leveraging Federal Funding for Tools
David Cahill, University of Illinois
Materials Characterization Using Ultrafast Lasers
Christian Boit, Berlin University of Technology
Failure Analysis Year in Review
Bill Thompson, ALIS Corp
Atomic Level Ion Source Microscopy
Rich Blish, Spansion, Efrat Raz, Gatan
"FA Role: Dynamic Driver or Passive Passenger?"
Dave Vallett, IBM
“Why Waste Our Time on Roadmaps When we Don’t Have Cars?”
Chris Henderson, Semitracks, Inc.
Failure Analysis Year in Review
Michael Strizich, Analytical Solutions
Top Five Field Failures
Balu Pathangey, Intel
Package Contamination and its Effects on Functionality
Jerry Soden, Sandia National Labs
Failure Analysis Of High Consequence Devices
Shalabh Tandon et al., Intel
Approach to Failure Analysis in Complex Microelectronics Packages
Mark Spearing, University of South Hampton, UK
MEMS Materials And Reliability: Experiences From Power MEMS Projects Speakers
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